cystech electronics corp. spec. no. : c310m3 issued date : 2007.01.10 revised date : 2013.08.07 page no. : 1/6 BTD1768M3 cystek product specification npn epitaxial planar transistor BTD1768M3 features ? high v ceo , v ceo =80v ? high i c , i c(dc) =1a ? low v ce (sat) ? good current gain linearity ? complementary to btb1198m3 ? pb-free lead plating symbol outline BTD1768M3 sot-89 b base b c e c collector e emitter absolute maximum ratings (ta=25 c) parameter symbol limit unit collector-base voltage v cbo 100 v collector-emitter voltage v ceo 80 v emitter-base voltage v ebo 5 v collector current (dc) i c 1 a collector current (pulse) i cp 2 (note 1) a 0.6 w 1 (note 2) w power dissipation pd 2 (note 3) w 208 c/w 125 (note 2) c/w thermal resistance, junction to ambient r ja 62.5 (note 3) c/w junction temperature tj 150 c storage temperature tstg -55~+150 c note : 2. when mounted on fr-4 pcb with area measuring 10101 mm 1. single pulse pw Q 350 s, duty Q 2%. 3. when mounted on ceramic with area measuring 40401 mm
cystech electronics corp. spec. no. : c310m3 issued date : 2007.01.10 revised date : 2013.08.07 page no. : 2/6 BTD1768M3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo 100 - - v i c =50 a, i e =0 bv ceo 80 - - v i c =1ma, i b =0 bv ebo 5 - - v i e =50 a, i c =0 i cbo - - 1 a v cb =80v. i e =0 i ebo - - 1 a v eb =4v,i c =0 *v ce(sat) - - 0.3 v i c =500ma, i b =20ma *h fe 120 - 390 - v ce =3v, i c =100ma f t - 100 - mhz v ce =10v, i c =50ma, f=100mhz cob - 20 - pf v cb =10v, f=1mhz *pulse test : pulse width 380 s, duty cycle 2% classification of h fe rank q r range 120~270 180~390 ordering information device package shipping BTD1768M3 sot-89 (pb-free lead plating package) 1000 pcs / tape & reel recommended soldering footprint
cystech electronics corp. spec. no. : c310m3 issued date : 2007.01.10 revised date : 2013.08.07 page no. : 3/6 BTD1768M3 cystek product specification typical characteristics current gain vs collector current 10 100 1000 1 10 100 1000 collector current---ic(ma) current gain--- hfe hfe@vce=2v hfe@vce=3v saturation voltage vs collector current 10 100 1000 1 10 100 1000 collector current---ic(ma) saturation voltage---(mv) vcesat@ic=20ib vbesat@ic=20ib on voltage vs collector current 100 1000 1 10 100 1000 collector current---ic(ma) on voltage---(mv) vbe(on)@vce=2v power derating curves 0 0.5 1 1.5 2 2.5 0 50 100 150 200 ambient temperature --- ta( ) power dissipation---pd(w) see note 2 on page 1 see note 1 on page 1
cystech electronics corp. spec. no. : c310m3 issued date : 2007.01.10 revised date : 2013.08.07 page no. : 4/6 BTD1768M3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c310m3 issued date : 2007.01.10 revised date : 2013.08.07 page no. : 5/6 BTD1768M3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c310m3 issued date : 2007.01.10 revised date : 2013.08.07 page no. : 6/6 BTD1768M3 cystek product specification sot-89 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1732 0.1811 4.40 4.60 f 0.0591 typ 1.50 typ b 0.1551 0.1673 3.94 4.25 g 0.1181 typ 3.00 typ c 0.0610 ref 1.55 ref h 0.0551 0.0630 1.40 1.60 d 0.0906 0.1024 2.30 2.60 i 0.0138 0.0173 0.35 0.44 e 0.0126 0.0205 marking: e f g c b a i d h 3 2 1 3-lead sot-89 plastic surface mounted package cystek package code: m3 style: pin 1. base 2. collector 3. emitter product code hfe rank month code: 1~9, a,b,c wafer code 0.32 0.52 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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